Apparatus for handling and manipulating microelectronic components

ABSTRACT

A microelectronic component handling system and an apparatus for manipulating microelectronic components in manufacturing assembly processes. In one embodiment, a microelectronic component handling system may have a base or a support member, a track or platform attached to the base to rotate about a rotational axis, and a linear drive assembly to rotate the track about the rotational axis. The track may have a first end, a second end spaced apart from the first end along a longitudinal axis of the track, a top surface facing away from the base, and a bottom surface facing toward the base. Additionally, the linear drive assembly may have an actuator and a rod driven by the actuator along a displacement axis spaced apart from the rotational axis. In operation, the actuator moves the rod along the displacement axis to rotate the track about the rotational axis to a raised position at an inclination sufficient to slide a microelectronic component down the track. In one particular application of a handling system in accordance with the invention, the handling system is a constituent part of a lead configuring device having a first die with a first blade set and a second die with a second blade set. In another particular application, the handling system is a constituent part of a microelectronic component assembly line in which the track is positioned between first and second assembly line sections.

TECHNICAL FIELD

The present invention relates to handling and/or manipulatingmicroelectronic components in machines used for processingmicroelectronic components.

BACKGROUND OF THE INVENTION

Microelectronic components are used in computers, communicationsequipment, televisions and many other products. Microelectroniccomponents may be packaged devices with a number of leads configured toengage corresponding contact sites on a printed circuit board (PCB), orthey may be unpackaged devices that are connected to correspondingcontact sites on the PCB via surface mounting or wire bondingtechniques. In the computer industry, typical microelectronic componentsinclude processors, memory devices and other sophisticated componentswith integrated circuitry (IC). For example, one type of memory deviceis a TSOP memory component (TSOP) that has a memory device, a protectivepackage enclosing the device, and a plurality of very thin leadsprojecting from the package. Since the electronics manufacturingindustry is highly competitive, it is important to maximize thethroughput of manufacturing or installing TSOPs and other types ofmicroelectronic components.

To prepare a packaged microelectronic component for assembly with a PCB,the leads must be configured to mate with the PCB. Additionally, anyprotective items other than the package enclosing the IC device shouldbe separated from the packaged components. For example, prior to cuttingand bending the leads of a TSOP, these devices generally have aprotective frame surrounding the packaged device and attached to theends of the leads. The frame protects the TSOP leads from being bent ordamaged until the TSOP is ready to be mounted to a PCB. Accordingly, toprepare the TSOP for being mounted to a PCB, the TSOP is placed in astamping machine that cuts the leads to remove the frame from thefinished TSOP and to configure the leads to mate with the PCB. After theleads have been cut, the finished TSOP and the frame are removed fromthe stamping machine.

One manufacturing concern with handling TSOPs is that it is timeconsuming to separate the finished TSOP from the frame after the leadshave been cut. In a typical application, a machine operator manuallyuses tweezers or a vacuum device to separately remove the finished TSOPand the frame. However, manually reaching into the stamping machine andgrasping only the TSOP or the frame with a hand-held tool is difficultbecause the TSOPs and frames are small, delicate pieces. Accordingly, itis time consuming to reach in and manually separate the finished TSOPfrom the frame.

Another manufacturing concern with conventional manufacturing processesis that manually removing the frame from the finished TSOP may damagethe TSOP. For example, because these components are so small, it isdifficult to separate the TSOP from the frame without inadvertentlybending the leads of the TSOP. In some instances, the leads of the TSOPmay be damaged because the operator may not have a good grasp of theTSOP and it may fall to the floor or in the stamping machine. In otherinstances, the operator may inadvertently bump the TSOP leads againstthe frame in a manner that damages the delicate leads of the TSOP.Therefore, manually removing the finished TSOPs from the frames maydamage some of the finished TSOPs.

SUMMARY OF THE INVENTION

The present invention is directed toward microelectronic componenthandling systems and machines for manipulating microelectroniccomponents in manufacturing processes. In one embodiment, amicroelectronic component handling system may have a base or a supportmember, a track or platform attached to the base to rotate about arotational axis, and a linear drive assembly to rotate the track aboutthe rotational axis. The track may have a first end, a second end spacedapart from the first end along a longitudinal axis of the track, a topsurface facing away from the base, and a bottom surface facing towardthe base. Additionally, the linear drive assembly may have an actuatorand a rod driven by the actuator along a displacement axis spaced apartfrom the rotational axis. In operation, the actuator moves the rod alongthe displacement axis to rotate the track about the rotational axis to araised position in which the inclination of the track is sufficient toallow a microelectronic component to slide down the track.

In one particular application of a handling system in accordance withthe invention, the handling system is a constituent part of a leadconfiguring device having a first die with a first blade set and asecond die with a second blade set. The second die is moveable withrespect to the first die to cut a plurality of leads of a packagedmicroelectronic component with the first and second blade sets. In thisembodiment, the base may have a backwall attached to the first die, afooting projecting from a lower portion of the backwall to carry thedrive assembly, and a plurality of fingers projecting from an upperportion of the backwall. The fingers may include first and secondfingers spaced apart from one another by a gap over the rod of the driveassembly, and a shaft may extend between the fingers along therotational axis at a forward portion of the fingers. Additionally, thetrack may be pivotally coupled to the shaft, and the track may haveopposing side rims defining opposing sides of an opening configured toreceive the first blade set of the first die when the track is in alowered position. In operation, a protective frame portion of amicroelectronic component rests on the side rims of the track as thefirst and second blade sets cut the leads of the packagedmicroelectronic component. After the leads have been cut, the driveassembly rotates the track about the shaft to lift the protective framefrom the finished packaged component. The track may be rotated upward toan inclination at which the frame slides down the track and into a wastereceptacle.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial isometric view of a lead configuring apparatus witha microelectronic component handling system in accordance with oneembodiment of the invention.

FIG. 2 is a front elevational view of the lead configuring apparatus andthe microelectronic handling system of FIG. 1.

FIG. 3A is a side elevational view of a portion of the lead configuringapparatus and the microelectronic component handling system of FIG. 1 ina lowered position.

FIG. 3B is a side elevational view of the portion of the leadconfiguring apparatus and the microelectronic component handling systemof FIG. 3B in a raised position.

FIG. 4A is a side elevational view of another microelectronic componenthandling system in accordance with another embodiment of the invention.

FIG. 4B is a side elevational view illustrating one embodiment of theoperation of the microelectronic component handling system of FIG. 4A.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed toward handling systems formanipulating selected microelectronic components in manufacturingprocesses. Many specific details of certain embodiments of handlingsystems and other related apparatus are set forth in the followingdescription and in FIGS. 1-4B to provide a thorough understanding ofsuch embodiments. One skilled in the art, however, will understand thatthe present invention may have additional embodiments that may bepracticed without several of the details described in the followingdescription.

FIG. 1 is an isometric view and FIG. 2 is a front elevational view of alead configuring device 10 for cutting and configuring a plurality ofleads of a microelectronic component. The lead configuring device 10 hasa component handling apparatus 12 attached to a lead cutter 14. Thisembodiment of the lead configuring device 10 is particularly well suitedfor cutting the leads 17 of a packaged device 16 to separate thepackaged device 16 from a protective frame 18 and a waste portion 19 ofthe leads 17. Prior to cutting the leads 17, the frame 18 protects thepackaged device 16 and the leads 17. After the leads 17 have been cut,the package device 16 remains on the lead cutter 14, and the handlingapparatus 12 lifts frame 18 from the lead cutter 14 to selectivelyremove the frame 18 from the packaged device 16 (FIG. 2). In light ofthis embodiment of the lead configuring device 10, a particularembodiment of the component handling apparatus 12 will now be described.

The component handling apparatus 12 may have several parts including asupport member 20, a track 30 pivotally attached to the support member20 to rotate about a rotational axis R--R, a biasing element 50(indicated by reference numbers 50a and 50b) to bias the track 30downward toward the support member 20, and a drive assembly 60 to rotatethe track 30 upward from the support member 20. The component handlingapparatus 12 may be attached to the lead cutter 14, or the handlingapparatus 12 may be a self-standing unit. Accordingly, the individualparts of the handling apparatus 12 may have many different embodiments.

The support member 20 of the handling apparatus 12, for example, may bea base or bracket. In one embodiment, the support member 20 has afooting 21, a backwall 22 extending upward from the footing 21, and anumber of fingers 24 (indicated by reference numbers 24a and 24b)projecting from an upper portion of the backwall 22. The fingers 24 maybe separated by a gap 26 (FIG. 1), and each of the fingers 24 mayterminate at an inclined surface 25 (indicated by reference numbers 25aand 25b). The inclined surfaces 25 are generally sloped at an angle toprevent the track 30 from rotating beyond a maximum angle of forwardinclination. The support member 20 may also have a shaft 27 extendingbetween the fingers 24 along the rotational axis R--R, a channel 28(FIG. 1) extending parallel to the rotational axis R--R along an upperportion of the backwall 22, and a number of pins 29 projecting from alower portion of the backwall 22. The support member 20 may be made froma metal, a polymer or any other suitably strong material. For example,the support member 20 may be machined from a block of aluminum or a highdensity polymeric material. It will be appreciated that the supportmember 20 shown in FIGS. 1 and 2 is indicative of only one type of basefor pivotally carrying the track 30, and thus many other configurationsof support members may be used.

The track 30 of the handling apparatus 12 may be an elongated bar oranother type of platform. In one embodiment, the track 30 has a firstend 31, a second end 32 opposite the first end, a top surface 33 forcarrying the frame 18, and a bottom surface 34 facing toward the base20. A number of sidewalls 36 may project upward from the top surface 33and extend along the elongated edges of the track 30 between the firstend 31 and the second end 32. The track 30 may also have a processingsite 37 with an opening 38 towards the second end 32 and side rims 39along opposing sides of the opening 38. The opening 38 is configured toreceive the packaged device 16 and the leads 17 after the leads havebeen cut. Additionally, the opposing side rims 39 are configured tosupport opposing edges of the frame 18, and the sidewalls 36 are spacedapart from one another by a distance approximately equal to the distancebetween the opposing sides of the frame 18. The track 30 may be composedof many different materials, such as aluminum or stainless steel. In oneparticular embodiment, the upper surface 33 is polished stainless steelto provide a low friction surface so that the frame 18 easily slidesalong the track 30 when the track 30 is raised as shown in FIG. 1.

The track 30 may be pivotally attached to the support member 20 by ablock 40 (FIG. 2) that receives the shaft 27 and is fixedly attached tothe bottom surface 34 of the track 30 by a number of screws (not shownin FIGS. 1 and 2). The block 40 projects downward from the bottomsurface 34 between the fingers 24, and it has a central surface 42facing downward toward the footing 21 of the support member 20. An arm48 attached to the block 40 projects outwardly from the fingers 24 sothat grooves 49 in the arm 48 are aligned with grooves in the pins 29 ofthe support member 20. Accordingly, one biasing member 50a may beattached to one end of the arm 48 and one of the pins 29, and anotherbiasing element 50b may be attached to the other end of the arm 48 andthe other pin 29. The biasing elements 50 may be elastic bands (shown inFIG. 1), springs (shown in FIG. 2) or any other resilient devices thatpull the second end 32 of the track 30 downward toward the supportmember 20.

The drive assembly 60 of the handling apparatus 12 rotates the track 30upward with respect to the support member 20 into the raised positionshown in FIG. 1. In one embodiment, the drive assembly 60 has anactuator 62 attached to the footing 21 of the support member 20, a rod64 driven by the actuator 62 along a displacement axis D--D (FIG. 1),and a rounded head or button 66 attached to the end of the rod 64. Thehead 66 is preferably a hemispherical button composed of a high wear,low friction material, such as Delrin® manufactured by E. I. duPont deNemours & Co. The actuator 62 may be a pneumatic actuator or a servomotor that moves the rod 64 linearly along the displacement axis D--D ata controlled linear velocity. One suitable linear actuator is a HumphreyPneumatic Cylinder Model No. HJDAS 12×5/8. Additionally, suitable servomotors may selectively drive the rod 64 along the displacement axis D--Dfor controlled, well-defined distances.

In operation, the actuator 62 extends the rod 64 along the displacementaxis D--D so that the head 66 engages the central surface 42 of theblock 40 (FIG. 2). The actuator 62 moves the rod 64 along thedisplacement axis in engagement with the central surface 42 for asufficient distance to rotate the track 30 about the rotational axisR--R from the lowered position (FIG. 2) to the raised position (FIG. 1).The actuator 62 also moves the rod 64 at a controlled linear velocity torotate the track 30 at a controlled angular velocity allowing the frame18 to slide down the top surface 33 of the track 30 until it passesbeyond the first end 31. Accordingly, the linear actuator 62 should notrotate the track 30 at such a high angular velocity that the frame 18 isthrown from the track 30 prior to passing beyond the first end 31 of thetrack.

The embodiment of the component handling apparatus 12 is particularlywell-suited for removing the frame 18 of a TSOP memory device from thelead cutter 14. To better understand this particular application for thecomponent handling apparatus 12, the structure and operation of the leadcutter 14 will be described. The lead cutter 14 may have a first die 80with first blades 84 (identified by reference numbers 84a and 84b inFIG. 1) and a second die 90 with second blades 94 (identified byreference numbers 94a and 94b in FIG. 2). The first and second blades 84and 94 are configured to engage opposing sides of the leads 17 extendingfrom the packaged device 16. The second die 90 is supported by actuatedlegs 96 that move the second die 90 upward and downward with respect tothe first die 80. The component handling apparatus 12 is coupled to thelead cutter 14 to remove the frame 18 from the lead cutter 14 withoutdisturbing the packaged device 16. Thus, the backwall 22 of the supportmember 20 may be fixedly attached to the first die 80 by a plurality ofbolts (not shown), and the processing site 37 may be located on thetrack 30 so that the opening 38 receives a boss 82 and the first blades84 of the first die 80.

FIG. 3A is a side elevational view illustrating one stage in theoperation of the configuring device 10. At this stage, the rod 64 of thedrive assembly 60 is retracted into the linear actuator 62 such that thebiasing elements 50 hold the track 30 in the lowered position againstthe first die 80. The boss 82 and the first blades 84 are accordinglypositioned in the opening 38 of the track 30. A microelectroniccomponent, such as a TSOP, is placed at the processing site 37 and thenthe second die 90 (FIGS. 1 and 2) moves downward to engage the first andsecond blades 84 and 94 with the leads 17. After the leads 17 aresevered, the second die 90 moves upward and the linear actuator 62extends the rod 64 to engage the button 66 with the central surface 42of the block 40. As the linear actuator 62 continues to move the rod 64along the displacement axis D--D, the track 30 rotates about the shaft27 into the raised position.

FIG. 3B is a side elevational view illustrating another stage in theoperation of the lead configuring device 10 after the track 30 hasreached the raised position. At this point, the packaged device 16remains on the first blades 84 of the first die 80, but the frame 18slides down the top surface of the track 33 and into a waste receptacle99. After the frame 18 lands in the waste receptacle 99, the linearactuator 62 and/or the biasing elements 50 retract the rod 64 to rotatethe track 30 back to the lowered position (FIG. 3A).

The particular embodiment of the handling system 12 described abovequickly removes the frame 18 from the packaged device 16 to increase thethroughput of finished components. For example, compared to manualmethods in which the operator manually removes the packaged device 16and the frame 18 from the lead cutter 14, the handling system 12 liftsthe frame 18 without disturbing the packaged device 16 immediately aftercutting the leads 17. The operator or a robotic mechanism may theneasily grasp only the packaged device 16 to remove it from the leadcutter 14. In either case, removing the frame 18 with the handlingsystem 12 reduces the time to process packaged devices because theoperator does not manually remove the frame 18.

The embodiment of the handling system 12 also is expected to reduce thepotential of damaging packaged devices compared to manually removingboth the packaged devices and the frames from the lead cutter.Conventional processes without the handling system 12 typically manuallyremove the packaged device 16 from the boss 82, and then manually removethe frame 18. However, because the packaged device 16 and the frame 18are quite small, it is difficult to individually grasp and move eitherof these devices when they are close together. As such, operators maydrop some of the packaged devices 16 causing damage to the leads 17.Compared to conventional manual handling methods, the embodiment of thehandling system 12 may reduce the potential of damaging packaged devices16 because it separates the frame 18 from the finished packaged device16 to expose more area around the packaged device 16. An operator,therefore, may more easily grasp the packaged device 16 and remove itfrom the configuring machine 10.

The embodiment of the handling system 12 described above also accuratelysends the frame 18 into the waste receptacle 99. In developing theembodiment of the handling system 12 shown in FIGS. 1-3B, initialhandling systems had a rotational drive assembly with a rotationalactuator, a rotating shaft driven by the rotational actuator, and a pinextending radially from the shaft to engage the bottom surface of thetrack 30 very close to the rotational axis. Such a rotational driveassembly, however, was difficult to control. For example, the rotationalactuator often rotated the shaft too fast causing the track 30 to rotateabout the shaft 27 so quickly that the frame 18 was thrown from thetrack 30 prior to sliding into the receptacle 99. On the other hand, therotational actuator also rotated the shaft too slow causing the track 30to rotate so slowly that the frame 18 did not slide off of the track 30.The handling system 12, however, overcomes this problem by spacing therod 64 apart from the shaft 27 by a distance "D" (FIG. 3A) and movingthe rod at a controlled linear velocity. In one particular application,the distance D between the rod 64 and the shaft 27 may be approximately0.25 to 2.0 inches, and the height "H" (FIG. 3B) that the rod 64 liftsthe central surface 42 of the block 40 between the lowered position andthe raised position may be approximately 0.75 to 3.0 inches.Additionally, the linear actuator 62 moves the rod 64 at a controlledlinear velocity to rotate the track 30 at a controlled angular velocityabout the shaft 27. By separating the rod 64 from the shaft 27 andmoving the rod 64 at a controlled linear velocity, the rod 64 rotatesthe track 130 in a controlled manner to allow the frame 18 to slide downtrack 30 and into the receptacle 99.

FIG. 4A is a side elevational view illustrating another embodiment of acomponent handling system 112 for removing selected microelectroniccomponents from an assembly line. The component handling system 112 maybe similar to that described above with respect to FIGS. 1 and 2, andthus like reference numbers generally refer to similar components. Inthis embodiment, the handling system 112 has a support member 20, ablock 40 pivotally attached to a shaft 27 of the support member 20, abiasing element 50 attached to an arm 48 and a pin 29, and a driveassembly 60 attached to the support member 20. The handling system 112may also have a track 130 attached to the block 40 to pivot with theblock 40 about the support member 20. The track 130 may have a topsurface 133 and a stop element 135 depending downward from one end ofthe track 130. Additionally, the track 130 may be aligned with a firstassembly line section 136 and a second assembly line section 138. Whenthe track 130 is aligned with the first and second assembly line section136 and 138, a component (not shown in FIG. 4A) positioned at aprocessing site 137 of the first assembly line section 136 may betranslated across the upper surface 133 of the track 130 to the secondassembly line section 138.

FIG. 4B is a side elevational view illustrating the operation of thecomponent handling system 112 for manipulating a microelectroniccomponent 116 after being tested or processed at the processing site137. Prior to positioning the microelectronic component 116 at theprocessing site 137, the linear actuator 62 drives the rod 64 to rotatethe track 130 to an intermediate position (FIG. 4B) in which the stopelement 135 blocks the end of the first assembly line section 136. Themicroelectronic component 116 then slides along the first assembly linesection 136 until it engages the stop 135. The stop 135 accordinglylocates the component 116 at the processing site 137. The component 116is then tested by a testing device (not shown) or processed by anotherprocessing device (not shown) at the processing site 137. After thecomponent 116 has been operated upon at the processing site 137, theactuator 62 releases the rod 64 and the biasing elements 50 lower thetrack 130 into a lowered position (FIG. 4A) so that the top surface 133of the track 130 is coplanar with the first and second assembly linesections 136 and 138. The microelectronic component 116 is thetranslated onto the top surface 133 of the track 130. If the component116 is operative, the track 130 remains in the lowered position (FIG.4A) and is translated across the track 130 to the second assembly linesection 138. However, if the component 116 is not operative, theactuator 62 then re-extends the rod 64 to rotate the track 130 upwardlybeyond the intermediate position shown in FIG. 4B to a raised position(e.g., FIG. 1) until the defective component slides down the track 130and into a waste receptacle 99.

From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention. Accordingly, the invention is notlimited except as by the appended claims.

What is claimed is:
 1. A microelectronic component handling system formoving selected microelectronic components in manufacturing processes,comprising:a support member; a platform pivotally attached to thesupport member to rotate about a rotational axis, wherein the platformcomprises a track having a first end, a second end, a first sidewall onone side of the track, a second sidewall on another side of the track, atop surface between the first and second sidewalls such that the firstsidewall extends along one side of the top surface and the secondsidewall extends along an opposite side of the top surface, an openingthrough the top surface at the second end defining a first side rimbetween the opening and the first sidewall and a second side rim betweenthe opening and the second sidewall, wherein the opening is configuredto pass a cut microelectronic device completely through the track, andwherein the first and second side rims are configured to hold a framefrom which the microelectronic device was cut; and a linear driveassembly positioned under the track, the drive assembly having anactuator and a rod driven by the actuator along a displacement axisspaced apart from the rotational axis by a first distance, the actuatormoving the rod along the displacement axis for a second distance torotate the second end of the track about the rotational axis to a raisedposition to pass the microelectronic device through the track and toslide the frame down the track.
 2. The component handling system ofclaim 1, further comprising a wear block attached to a bottom surface ofthe platform, the wear block having a central surface above the rod toengage an upper end of the rod as the actuator moves the rod upwardalong the displacement axis.
 3. The component handling system of claim 2wherein the drive assembly has a low friction button attached to anupper end of the rod, the low friction button sliding along the centralsurface of the block as the actuator moves the rod upward along thedisplacement axis.
 4. The component handling system of claim 1 whereinthe support member comprises a footing carrying the actuator, a wallextending upward from the footing, a plurality of fingers projectingfrom an upper portion of the wall including first and second fingersspaced apart by a gap over the rod of the drive assembly, and a shaftextending between the first and second fingers along the rotational axisacross a front portion of the gap, the shaft pivotally coupling theplatform to the support member.
 5. The component handling system ofclaim 4, further comprising a wear block attached to a bottom surface ofthe platform and attached to the shaft of support member, the wear blockhaving a central surface above the rod to engage an upper end of the rodas the actuator moves the rod upward along the displacement axis.
 6. Thecomponent handling system of claim 5 wherein the drive assembly has alow friction button attached to an upper end of the rod, the lowfriction button sliding along the central surface of the block as theactuator moves the rod upward along the displacement axis.
 7. Thecomponent handling system of claim 1, further comprising a biasingmember coupled to the support member and the platform to bias theplatform downward about the rotational axis.
 8. The component handlingsystem of claim 1 wherein the actuator comprises a pneumatic cylinder.9. The component handling system of claim 1 wherein the actuatorcomprises a servo motor.
 10. The component handling system of claim 1wherein:the support member comprises a footing carrying the actuator, awall extending upward from the footing, a plurality of fingersprojecting from an upper portion of the wall including first and secondfingers spaced apart by a gap over the rod of the drive assembly, and ashaft extending between the first and second fingers along therotational axis across a front portion of the gap, the shaft pivotallycoupling the platform to the support member; a wear block is attached toa bottom surface of the platform and attached to the shaft of supportmember, the wear block having a central surface above the rod; the driveassembly has a low friction button attached to an upper end of the rod,the low friction button sliding along the central surface of the blockas the actuator moves the rod upward along the displacement axis; abiasing member is coupled to the support member and the platform to biasthe platform downward about the rotational axis; and the actuatorcomprises a pneumatic cylinder.
 11. A lead configuring device,comprising:a first die with a first blade set and a second die with asecond blade set, the second die being movable with respect to the firstdie to engage the first and second blade sets with a plurality of leadsof a packaged microelectronic component; a handling system for movingselected microelectronic components in manufacturing processes,comprisinga support member comprising a backwall attached to the firstdie, a footing projecting from a lower portion of the backwall andcarrying the drive assembly, a plurality of fingers projecting from anupper portion of the backwall including first and second fingers spacedapart by a gap over the rod of the drive assembly, and a shaft extendingbetween the first and second fingers along the rotational axis across afront portion of the gap, the shaft pivotally coupling the platform tothe support member; a platform pivotally attached to the support memberto rotate about a rotational axis, wherein the platform has a processingsite with an opening and opposing side rims along opposing sides of theopening, the opening being configured to receive the first blade set andthe packaged microelectronic component, and the side rims beingconfigured to hold opposing edges of a protective frame attached to theleads of the packaged component, the actuator rotating the platform withrespect to the support member after the leads have been cut to lift anend of the platform into a raised position in which the frame slidesdown the platform and into a receptacle; and a linear drive assemblypositioned under the platform, the drive assembly having an actuator anda rod driven by the actuator along a displacement axis spaced apart fromthe rotational axis by a first distance, the actuator moving the rodalong the displacement axis for a second distance to rotate the platformabout the rotational axis to a raised position at an inclination toslide the microelectronic component down the platform.
 12. The componenthandling system of claim 11, further comprising a wear block attached toa bottom surface of the platform and attached to the shaft of supportmember, the wear block having a central surface above the rod to engagean upper end of the rod as the actuator moves the rod upward along thedisplacement axis.
 13. The component handling system of claim 12 whereinthe drive assembly has a low friction button attached to an upper end ofthe rod, the low friction button sliding along the central surface ofthe block as the actuator moves the rod upward along the displacementaxis.
 14. The component handling system of claim 11, further comprisinga biasing member coupled to the support member and the platform to biasthe platform downward about the rotational axis.
 15. The componenthandling system of claim 11 wherein the actuator comprises a pneumaticcylinder.
 16. The component handling system of claim 11 wherein theactuator comprises a servo motor.
 17. A microelectronic device handlingapparatus for removing selected microelectronic components fromprocessing machines, comprising:a base having a footing, a wallprojecting upward from the footing, a first finger projecting from thewall over the footing, and a shaft projecting from the first finger, thefirst finger having an inclined face at a distal end sloping downwardtoward the footing; a track having a first end, a second end spacedapart from the first end along a longitudinal axis of the track, a topsurface facing away from the base, a bottom surface facing toward thebase, and a plurality of sidewalls spaced apart from one another acrossthe top surface by a distance to receive a frame for a microelectroniccomponent, the sidewalls including a first sidewall along one side ofthe top surface and a second sidewall along an opposing side of the topsurface, and the sidewalls extending between the first and second ends,the track further including an opening through the top surface at thesecond end defining a first side rim between the opening and the firstsidewall and a second side rim between the opening and the secondsidewall, wherein the opening is configured to pass a cutmicroelectronic device completely through the track, and wherein thefirst and second side rims are configured to retain the support frame,and the track being coupled to the shaft to rotate with respect to thebase; and a linear drive assembly having an actuator attached to thebase and a rod positioned under a portion of the bottom surface of thetrack, the actuator extending the rod upward away from the footing alonga displacement axis to rotate the track with respect to the base untilthe bottom surface of the track engages the inclined face of the finger.18. The device handling apparatus of claim 12, further comprising a wearblock attached to the bottom surface of the track, the wear block havinga central surface above the rod to engage an upper end of the rod as theactuator moves the rod upward along the displacement axis.
 19. Thedevice handling apparatus of claim 18 wherein the drive assembly has alow friction button attached to an upper end of the rod, the lowfriction button sliding along the central surface of the block as theactuator moves the rod upward along the displacement axis.
 20. Thedevice handling apparatus of claim 12, further comprising a biasingmember coupled to the base and the track to bias the track downwardabout the rotational axis.
 21. The device handling apparatus of claim 12wherein the actuator comprises a pneumatic cylinder.
 22. The devicehandling apparatus of claim 12 wherein the actuator comprises a servomotor.
 23. A lead configuring device, comprising:a first die with afirst blade set and a second die with a second blade set, the second diebeing movable with respect to the first die to engage the first andsecond blade sets with leads of a packaged microelectronic component;and a microelectronic device handling apparatus includingbase having afooting, a wall projecting upward from the footing, a first fingerprojecting from the wall over the footing, and a shaft projecting fromthe first finger, the first finger having an inclined face at a distalend sloping downward toward the footing; a track having a first end, asecond end spaced apart from the first end along a longitudinal axis ofthe track, a top surface facing away from the base, a bottom surfacefacing toward the base, and a plurality of sidewalls spaced apart fromone another across the top surface by a distance to receive amicroelectronic component, the sidewalls extending between the first andsecond ends, and the track being coupled to the shaft to rotate withrespect to the base, wherein the track has a processing site with anopening and opposing side rims along opposing sides of the opening, theopening being configured to receive the first blade set and the packagedmicroelectronic component, and the side rims being configured to holdopposing edges of a protective frame attached to the leads of thepackaged component, the actuator rotating the track with respect to thebase after the leads have been cut to lift an end of the track into araised position in which the frame slides along the track and into areceptacle; and a linear drive assembly having an actuator attached tothe base and a rod positioned under a portion of the bottom surface ofthe track, the actuator extending the rod upward away from the footingalong a displacement axis to rotate the track with respect to the baseuntil the bottom surface of the track engages the inclined face of thefinger.
 24. The device handling apparatus of claim 23, furthercomprising a wear block attached to the bottom surface of the track andattached to the shaft of base, the wear block having a central surfaceabove the rod to engage an upper end of the rod as the actuator movesthe rod upward along the displacement axis.
 25. The device handlingapparatus of claim 24 wherein the drive assembly has a low frictionbutton attached to an upper end of the rod, the low friction buttonsliding along the central surface of the block as the actuator moves therod upward along the displacement axis.